2020 Global Wafer Bonders Market Outlook
Wafer bonding is commonly used in Front-end of line (FEOL) operational steps as wafer-to-wafer bonding provides strength if the device wafer is to be thinned to ultra-thin dimensions. The statistic scope is wafer bonder in this report.
The global Wafer Bonders market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Wafer Bonders volume and value at global level, regional level and company level. From a global perspective, this report represents overall Wafer Bonders market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.
The following manufacturers are covered:
EV Group (EVG)
SUSS MicroTec
Dynatex International
AML
Mitsubishi Heavy Industries
Kulicke & Soffa Industries, Inc
Ayumi Industries Company Limited
Tokyo Electron Limited
Tokyo Ohka Kogyo Co., Ltd
Finetech GmbH & Co. KG
Segment by Regions
North America
Europe
China
Japan
South Korea
Segment by Type
Semi-Auto Type
Fully Automatic Type
Segment by Application
MEMS
Advanced Packaging (BSI CIS, CIS capping WLP, 3D stack TSV)
LED Devices
SOI Substrate
Others
The global Wafer Bonders market is valued at xx million US$ in 2018 is expected to reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2019-2025.
This report focuses on Wafer Bonders volume and value at global level, regional level and company level. From a global perspective, this report represents overall Wafer Bonders market size by analyzing historical data and future prospect. Regionally, this report focuses on several key regions: North America, Europe, China and Japan.
At company level, this report focuses on the production capacity, ex-factory price, revenue and market share for each manufacturer covered in this report.
The following manufacturers are covered:
EV Group (EVG)
SUSS MicroTec
Dynatex International
AML
Mitsubishi Heavy Industries
Kulicke & Soffa Industries, Inc
Ayumi Industries Company Limited
Tokyo Electron Limited
Tokyo Ohka Kogyo Co., Ltd
Finetech GmbH & Co. KG
Segment by Regions
North America
Europe
China
Japan
South Korea
Segment by Type
Semi-Auto Type
Fully Automatic Type
Segment by Application
MEMS
Advanced Packaging (BSI CIS, CIS capping WLP, 3D stack TSV)
LED Devices
SOI Substrate
Others
Frequently Asked Questions
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