Global Solder Preform Market 2019 by Manufacturers, Regions, Type and Application, Forecast to 2024

Solder Preform is pre-forms of solid solder alloys with potential to change the future. Combination of machining technologies such as rolling and pressing are used to process the solder alloy into various shapes like squares, rectangles, washers and discs. Typical sizes range from .010" (.254mm) up to 2" (50.8mm). Smaller and larger sizes, as well as custom shapes, are also available.

Scope of the Report:
Solder preform offers accurate solder deposition for various soldering processes. Solder preforms have various shape, such as squares, rectangles, washers, discs etc. According to its component, solder preforms can be divided into Au base, Ag based, In based, Sn-Pb as well as other types. When considering the lead content, lead-free has been the prominent trend.
The worldwide market for Solder Preform is expected to grow at a CAGR of roughly 7.6% over the next five years, will reach 550 million US$ in 2024, from 380 million US$ in 2019, according to a new study.
This report focuses on the Solder Preform in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers, this report covers
Ametek
Alpha
Kester
Indium Corporation
Pfarr
Nihon Handa
SMIC
Harris Products
AIM
Nihon Superior
Fromosol
Guangzhou Xianyi
Shanghai Huaqing
Solderwell Advanced Materials
SIGMA Tin Alloy

Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

Market Segment by Type, covers
Lead Free
Leaded

Market Segment by Applications, can be divided into
Military & Aerospace
Medical
Semiconductor
Electronics
Other

The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Solder Preform product scope, market overview, market opportunities, market driving force and market risks.
Chapter 2, to profile the top manufacturers of Solder Preform, with price, sales, revenue and global market share of Solder Preform in 2017 and 2018.
Chapter 3, the Solder Preform competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Solder Preform breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2014 to 2019.
Chapter 5, 6, 7, 8 and 9, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2014 to 2019.
Chapter 10 and 11, to segment the sales by type and application, with sales market share and growth rate by type, application, from 2014 to 2019.
Chapter 12, Solder Preform market forecast, by regions, type and application, with sales and revenue, from 2019 to 2024.
Chapter 13, 14 and 15, to describe Solder Preform sales channel, distributors, customers, research findings and conclusion, appendix and data source.

Frequently Asked Questions



This market study covers the global and regional market with an in-depth analysis of the overall growth prospects in the market. Furthermore, it sheds light on the comprehensive competitive landscape of the global market. The report further offers a dashboard overview of leading companies encompassing their successful marketing strategies, market contribution, recent developments in both historic and present contexts.

  • By product type
  • By End User/Applications
  • By Technology
  • By Region

The report provides a detailed evaluation of the market by highlighting information on different aspects which include drivers, restraints, opportunities, and threats. This information can help stakeholders to make appropriate decisions before investing.

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