Global Semiconductor Packaging Materials Market 2016-2020
- SKU ID : TNV-IRTNTR9245 10290444
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- Publishing Date: 18-Apr-2016
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- Region: Global
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- No. of pages: 112
About Semiconductor Packaging Materials
Semiconductor packages are metal, plastic, and ceramic components which not only protect the fabricated IC on the semiconductor die but also acts as an interconnect between the die and the PCB (printed circuit board). They protect the die from external mechanical impact and corrosion, and also act as electrically conductive interconnects with excellent signal propagation properties. Excess heat in the circuit is not allowed to build up by dissipation through attached heat spreaders. Packaging components vary in dimensions and functionality and mainly are organic substrates, leadframes, bonding wires, encapsulation resins, die attach materials, solder balls, and thermal interface materials, among others. The key customers of these packaging material are fabless semiconductor companies, packaging material suppliers, packaging subcontractors, semiconductor manufacturers, the electronics industry, and the automotive sector.
Technavio’s analysts forecast the global semiconductor packaging materials market to grow at a CAGR of 4.79% during the period 2016-2020.
Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor packaging materials market for the period 2016-2020. To calculate the market size and geographical segmentation, the report considers the revenue generated from the sales of different types of packaging based on the type of material, which can be broadly classified as either leadframe based or laminate substrate based.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
Technavio's report, Global Semiconductor Packaging Materials Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
• Amkor Technology
• DuPont
• Henkel
• Hitachi Chemical
• Honeywell
• KYOCERA
• Toppan Printing
Other prominent vendors
• Alpha Advanced Materials
• Applied Materials
• ASM Pacific Technology (ASMPT)
• BASF
• Beijing Doublink Solders
• Beijing Kehua New Chemical Technology
• Cheil Industries
• Duksan Hi-metal
• Diehl Metall
• Dynacraft
• Evergreen Semiconductor Materials
• Guangdong Rongtai
• Heesung Metal
• Heraeus
• Ibiden
• Indium
• IQE
• KCC
• LG Innotek
• Lintec
• Lord
• Mitsui High-Tec
• MK Electron
• Nanya PCB
• Ningbo Dongsheng IC
• Nippon Micrometal
• Nitto Denko
• Poongsan
• Samsung Techwin
• Shinko
• Shin-Etsu Chemical
• Shanghai Sinyang Semiconductor Materials
• Sumitomo Metal Mining
• Tanaka Denshi Kogyo
• Tatsuta Electronic Materials
• Xiamen Yonghong Electronics
Market driver
• Rising demand for polymer adhesive wafer bonding equipment
• For a full, detailed list, view our report
Market challenge
• Fluctuating foreign exchange rates
• For a full, detailed list, view our report
Market trend
• Rapid technological changes
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
Semiconductor packages are metal, plastic, and ceramic components which not only protect the fabricated IC on the semiconductor die but also acts as an interconnect between the die and the PCB (printed circuit board). They protect the die from external mechanical impact and corrosion, and also act as electrically conductive interconnects with excellent signal propagation properties. Excess heat in the circuit is not allowed to build up by dissipation through attached heat spreaders. Packaging components vary in dimensions and functionality and mainly are organic substrates, leadframes, bonding wires, encapsulation resins, die attach materials, solder balls, and thermal interface materials, among others. The key customers of these packaging material are fabless semiconductor companies, packaging material suppliers, packaging subcontractors, semiconductor manufacturers, the electronics industry, and the automotive sector.
Technavio’s analysts forecast the global semiconductor packaging materials market to grow at a CAGR of 4.79% during the period 2016-2020.
Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor packaging materials market for the period 2016-2020. To calculate the market size and geographical segmentation, the report considers the revenue generated from the sales of different types of packaging based on the type of material, which can be broadly classified as either leadframe based or laminate substrate based.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
Technavio's report, Global Semiconductor Packaging Materials Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
• Amkor Technology
• DuPont
• Henkel
• Hitachi Chemical
• Honeywell
• KYOCERA
• Toppan Printing
Other prominent vendors
• Alpha Advanced Materials
• Applied Materials
• ASM Pacific Technology (ASMPT)
• BASF
• Beijing Doublink Solders
• Beijing Kehua New Chemical Technology
• Cheil Industries
• Duksan Hi-metal
• Diehl Metall
• Dynacraft
• Evergreen Semiconductor Materials
• Guangdong Rongtai
• Heesung Metal
• Heraeus
• Ibiden
• Indium
• IQE
• KCC
• LG Innotek
• Lintec
• Lord
• Mitsui High-Tec
• MK Electron
• Nanya PCB
• Ningbo Dongsheng IC
• Nippon Micrometal
• Nitto Denko
• Poongsan
• Samsung Techwin
• Shinko
• Shin-Etsu Chemical
• Shanghai Sinyang Semiconductor Materials
• Sumitomo Metal Mining
• Tanaka Denshi Kogyo
• Tatsuta Electronic Materials
• Xiamen Yonghong Electronics
Market driver
• Rising demand for polymer adhesive wafer bonding equipment
• For a full, detailed list, view our report
Market challenge
• Fluctuating foreign exchange rates
• For a full, detailed list, view our report
Market trend
• Rapid technological changes
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
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