Global Semiconductor Chip Packaging Market 2017-2021
- SKU ID : TNV-IRTNTR11581 10436806
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- Publishing Date: 16-Jan-2017
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- Region: Global
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- No. of pages: 70
About Semiconductor Chip Packaging
The growth in the applications of semiconductor chips in industries such as the power, energy, medical, electric vehicles, automobiles, networking and telecommunications, consumer applications, military, aerospace and defense, motor control applications, and robotics is driving the market. Thus, the market for packaging equipment is expected to gain substantial ground during the forecast period, as packaged chips are used to improve functionality and performance of the devices in which they are applied.
Technavio’s analysts forecast the global semiconductor chip packaging market to grow at a CAGR of 31.1% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor chip packaging market for 2017-2021. To calculate the market size, the report considers the revenue generated from semiconductor chip packaging.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
Technavio's report, Global Semiconductor Chip Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
• Applied Materials
• ASM Pacific Technology
• Kulicke & Soffa Industries
• TEL
• Tokyo Seimitsu
Market driver
• Growing number of fabs
• For a full, detailed list, view our report
Market challenge
• Increasing complexity of semiconductor IC designs
• For a full, detailed list, view our report
Market trend
• Development of 3D chip packaging
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
The growth in the applications of semiconductor chips in industries such as the power, energy, medical, electric vehicles, automobiles, networking and telecommunications, consumer applications, military, aerospace and defense, motor control applications, and robotics is driving the market. Thus, the market for packaging equipment is expected to gain substantial ground during the forecast period, as packaged chips are used to improve functionality and performance of the devices in which they are applied.
Technavio’s analysts forecast the global semiconductor chip packaging market to grow at a CAGR of 31.1% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor chip packaging market for 2017-2021. To calculate the market size, the report considers the revenue generated from semiconductor chip packaging.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
Technavio's report, Global Semiconductor Chip Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
• Applied Materials
• ASM Pacific Technology
• Kulicke & Soffa Industries
• TEL
• Tokyo Seimitsu
Market driver
• Growing number of fabs
• For a full, detailed list, view our report
Market challenge
• Increasing complexity of semiconductor IC designs
• For a full, detailed list, view our report
Market trend
• Development of 3D chip packaging
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
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