Global Advanced Packaging Market by Manufacturers, Regions, Type and Application, Forecast to 2021

During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit board. Typical packaging configurations have included the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and package-on package setups of the 2000s, and, most recently, 2-D integrated-circuit technologies such as wafer-level, flip-chip, and through silicon via setups.

Scope of the Report:
This report focuses on the Advanced Packaging in Global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Market Segment by Manufacturers, this report covers
ASE
Amkor
SPIL
Stats Chippac
PTI
JCET
J-Devices
UTAC
Chipmos
Chipbond
STS
Huatian
NFM
Carsem
Walton
Unisem
OSE
AOI
Formosa
NEPES

Market Segment by Regions, regional analysis covers
North America (USA, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America, Middle East and Africa

Market Segment by Type, covers
3.0 DIC
FO SIP
FO WLP
3D WLP
WLCSP
2.5D
Filp Chip

Market Segment by Applications, can be divided into
Analog & Mixed Signal
Wireless Connectivity
Optoelectronic
MEMS & Sensor
Misc Logic and Memory
Other

There are 13 Chapters to deeply display the global Advanced Packaging market.

Chapter 1, to describe Advanced Packaging Introduction, product scope, market overview, market opportunities, market risk, market driving force;

Chapter 2, to analyze the top manufacturers of Advanced Packaging, with sales, revenue, and price of Advanced Packaging, in 2015 and 2016;

Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2015 and 2016;

Chapter 4, to show the global market by regions, with sales, revenue and market share of Advanced Packaging, for each region, from 2011 to 2016;

Chapter 5, 6, 7 and 8, to analyze the key regions, with sales, revenue and market share by key countries in these regions;

Chapter 9 and 10, to show the market by type and application, with sales market share and growth rate by type, application, from 2011 to 2016;

Chapter 11, Advanced Packaging market forecast, by regions, type and application, with sales and revenue, from 2016 to 2021;

Chapter 12 and 13, to describe Advanced Packaging sales channel, distributors, traders, dealers, appendix and data source.

Frequently Asked Questions